Thank you for attending Leti 4D3D Workshop 2017!
To download our presentations, please click below:
OPENING SESSION
Pascal Vivet, CEA-LETI, France
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SESSION 1. 3D Memory Devices
Chair: Jean-Francois Roy, UPMEM, France
- Non Volatile Memory: a wide spectrum of potential solutions
Luca Perniola, CEA-LETI, France
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- 3D Memory : Patent Landscape Analysis
Audrey Bastard, KNOWMADE, France
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- Power, Heat, Reliability: A 3D Physical Design Perspective
Aida Todri, LIRMM, France
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SESSION 2. 3D Emerging Memories and New Architecture Paradigms
Chair : Bastien Giraud, CEA-LETI, France
- Abundant-Data Computing: The N3XT 1,000X
Subhasish Mitra, Stanford University, France
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- Novel 3D technologies for the transition to cognitive systems
Bert Offrein, IBM Zurich, Switzerland
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- 3D Memories: Now and Then!
Christian Weiss, University of Kaiserslautern, Germany
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SESSION 3. 3D Technology Landscape and Advanced Imagers
Chair : Didier Lattard, CEA-LETI, France
- Evolution and adoption of 3D TSV and 2.5D technology : From high performance to consumers applications
Emilie Jolivet, YOLE, France
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- Advanced 3D technologies for innovative 3D architecture
S. Cheramy, CEA-LETI, France
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- Smart imager: Computer vision integration with 3D stack
Jerome Chossat, STMicroelectronics, France
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SESSION 4. 3D for High Performance Computing
Chair : Patrick Blouet, STMicroelectronics, France
- Emerging architectures for computing with 3D silicon integration
Denis Dutoit, CEA-LETI, France
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- 2.5D/3D Systems with Silicon Photonic NoCs: Efficient Thermal Management, Opportunities, and Challenges
Ayse Coskun, University of Boston, USA
Ayse Coskun, University of Boston, USA
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- In-memory Computing with Majority RRAM Operations
Pierre-Emmanuel Gaillardon, University of Utah, USA
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SESSION 5. Monolithic 3D : from Technology to Advanced Design
Chair: Sébastien Thuriès, CEA-LETI, France
- Technological status of monolithic 3D
Perrine Batude, CEA-LETI, France
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- Power, performance and area benefits of monolithic 3D-IC for equivalent Moore's Law scaling
Shidhartha Das, ARM, UK
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- On Efficient Ways to Use Commercial 2D IC EDA Tools to Build Commercial Quality Monolithic 3D IC Designs
Sung Kyu Lim, Georgia Institute of Technology, USA
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SESSION 6. 3D Design and Tools
Chair : Sung Kyu Lim, Georgia Institute of Technology, USA
- Design Considerations and Noise Issues for Heterogeneous Contactless 3-D ICs
Vasilis Pavlidis, Manchester University, UK
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- Chip-to-chip communication on interposer based systems
Andy Heinig, Fraunhofer Institute, Germany
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- Modeling Challenges in Electrical Design of 3DIC based Systems
Dusan Petranovic, Mentor Graphics, USA
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- HANOI Whiteboard Flow: the Seed for 2.5D-IC Implementation
Anna Fontanelli, Monozukiri, Italy
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Download (all presentations.zip)
We are looking forward to seeing you again next year at our Leti 4D3D Workshop